[Offer to Sell] Laser slicer system |
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| AHL-HP50 Laser slicer scribing and cutting metal materials, germanium, gallium arsenide and other sem ico nductor substrate material and processing solar cell board, silico n chips, potsherd and aluminum foil. -------------------------------------------------------------------------------- Functions and advantages the laser power can be continuously regulated high precision and high speed friendly man-machine contact surface which can show the cutting trace timing and the operated simply non-touch processing resulted by very low rate of invalid chips environmental protection and energy conservation Application scope |
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