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CMP POLISHING SLURRY


GRISH Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity de-ionized water, highly engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on the pH.
GRISH CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. GRISH supplies CMP polishing slurry to customers around the world and is the most competitive in quality and price.
Features:
● High speed polish: with large particle of colloidal silica (Grit size up to 150 nm)
● Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applications
● High purity: the content of Cu2+<50 ppb, without contamination on the work piece
● Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface
Typical Properties
Alkaline Type
pH: 9.8±0.5 SOQ-2 SOQ-4 SOQ-6 SOQ-8 SOQ-10 SOQ-12
Acidic Type
pH: 2.8±0.5 ASOQ-2 ASOQ-4 ASOQ-6 ASOQ-8 ASOQ-10 ASOQ-12
Grit Size(nm) 10~30 30~50 50~70 70~90 90~110 110~130
Appearance Milk white or semitransparent liquid
Density (g/ml) 1. 15±0.05

Component Content(wt%)
SiO2 15~30
Na2O ≤0.3
Heavy metal impurity ≤50 ppb

Silica Wafer Polishing Reference Data
Polishing Pressure 150 ~ 250 g/cm2
Polishing Temperature 32 ~ 40 °C (89 ~ 104 °F)
Dilution 1:1 - 20
Polishing duration 3 ~ 6 minutes

Packaging:
500 ml/bottle, 25 kg or 200 kg/barrel.
Customizations are available upon requests.

Storage:
Keep the stored temperature at 0~35℃ (32~95 °F). Frozen can result in irreversible product degradation below 0 ℃. High temperature above 35 ℃ may accelerate the growth of micro-organisms and gelation, as well as decrease the long-term stability of the silica sol. Generally, the storage time of alkaline slurries is about two years and of acidic slurries is about half a year.
Category: Machinery & Tools / Equipment Placement Date: Dec 18, 2009 GMT
Company name: Beijing Grish Hitech Co.,Ltd. Company type: Exporter, Importer, Manufacturer, Service
Contact Person: (Premium Membership required) Email: Send Inquiry
Address: (Premium Membership required) City: (Premium Membership required)
State: (Premium Membership required) Country: China CMP POLISHING SLURRY
Zip: (Premium Membership required) Web: (Premium Membership required)
Phone: (Premium Membership required) Fax: (Premium Membership required)

Offers list from this company:

  1. [Sell] Diamond Polishing Film
  2. [Sell] Grish precise Ceo2 polishing film
  3. [Sell] Grish precise Al2O3 polishing film
  4. [Sell] Grish precise SiC polishing film
  5. [Sell] Grish precise Sio2 polishing film
  6. [Sell] Diamond Polishing Slurry
  7. [Sell] CMP POLISHING SLURRY
  8. [Sell] Grish Ceo2 polishing slurry
  9. [Sell] GRISH Monocrystalline Diamond Powder
  10. [Sell] Grish Polycrystalline Diamond Powders
  11. [Sell] Grish Nano-diamond
  12. [Sell] GRISH Nano-graphite
  13. [Sell] Grish ultra fine a-Ao polishing powder
  14. [Sell] Grish ultra fine CeO2 polishing powder

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